- Capacity: 13
- Overall Size: 235mm x 209mm x 219mm
- D1 Dimension – distance from the H shaped end surface to the center line of the first pocket
- (SEMI Std): 28.58mm
- Pocket Spacing – The distance between pocket center lines: 12.7mm
- Pocket Flat – The width of the pocket at its narrowest distance: 8.75mm
- Material Description: BISHOP-3 is a conductive high performance resin that provides excellent heat resistance for long periods, chemical resistance and dimensional stability. Extremely low outgassing.
CR200F-10-02-B3-EX 200mm Wafer Carrier
H-shaped end for equipment interface. Card holder on solid end wall. Wash slots on bottom half of side walls. Wide pocket spacing for thick wafers. Can hold round substrates.