Photomask handling

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Increase Yields and Reduce Costs

As critical dimensions shrink, reticle patterns are more susceptible to contaminants. Random defects can be generated during shipping, handling, or storage as a consequence of particle deposition or damage of chrome lines due to ESD events. In order to meet the requirements of next-generation lithography Pozzetta photomask compacts are designed to reduce particles, prevent ESD, and reduce outgassing. By preventing random defects Pozzetta will increase your yields and reduce your costs.