- Capacity: 25+1
- Overall Size: 234mm x 203mm x 219mm
- D1 Dimension – distance from the H shaped end surface to the center line of the first pocket
- (SEMI Std): 25.4mm
- Pocket Spacing – The distance between pocket center lines: 6.35mm
- Pocket Flat – The width of the pocket at its narrowest distance: 2.0mm
- Material Description- BISHOP-3 is a conductive, high-performance resin that provides excellent heat resistance for long periods, has chemical resistance and dimensional stability. Extremely low outgassing.
CR200A-02B3-H BISHOP-3 200mm Wafer Carrier
H-shaped end for equipment interface. E-shaped handle on end wall. Wash slots in side walls. Excellent heat resistance and rigidity. Improved predictability of wafer location in the horizontal plane.