- Capacity: 12
- Overall Size: 177mm (6.97in) x 144mm (5.67in) x 172mm (6.77in)
- D1 Dimension – distance from the H-shaped end surface to the centerline of the first pocket: 18.92mm (0.74in)
- Pocket Spacing – The distance between pocket center lines: 9.52mm (0.37in)
- Pocket Flat – The width of the pocket at its narrowest distance: 3.81mm (0.15in)
- Material Description: BISHOP-3 is a conductive, high-performance resin that provides excellent heat resistance for long periods, chemical resistance and dimensional stability. It is extremely low outgassing which makes it an ideal option for storage and transport.
CR150A-10B3-CW 150mm Wafer Carrier
H-shaped end for equipment interface with a cardholder on the solid end wall. Wash slots at the bottom of sidewalls. Accommodates thick wafers and round substrates. Excellent heat resistance and rigidity. Ideal for use in high-temperature applications such as wafer baking, diffusion, and CVD. Enhanced stability for horizontal wafer handling.